Conector IDC hembra TE Connectivity, paso 1.0mm

TE Connectivity’s (TE) new LGA 3647 socket solution meets the next-generation designs of Intel’s new CPU processors for higher performance and better system scaling.

Two-piece design for increased reliability: First LGA socket to feature a two-piece design that improves issues with warpage and offers better coplanarity and reliability
Dependable partner: As new generations of chip platforms are developed, TE will offer the latest LGA sockets for your designs
Applications
Servers
Data Centers
High Performance Computing (HPC)