Módulo 4 GB DDR4, UltraSOM+ MPSoC-Modul with Zynq UltraScale+ XCZU9EG-2FFVC900I de Trenz Electronic GmbH
- Código RS:
- 176-0795
- Nº ref. fabric.:
- TE0808-04-09EG-2IE
- Fabricante:
- Trenz Electronic GmbH
Producto Descatalogado
- Código RS:
- 176-0795
- Nº ref. fabric.:
- TE0808-04-09EG-2IE
- Fabricante:
- Trenz Electronic GmbH
Documentación Técnica
Legislación y Conformidad
- COO (País de Origen):
- DE
Datos del Producto
Trenz Electronic GmbH Programmable Logic Development Kits
The Trenz electronic is an MPSoC module integrating a Xilinx Zynq UltraScale+ ZU9EG. It comes with 4Gb DDR4 SDRAM along with a 64-bit width, 128Mb flash memory for configuration and operation. This board has 20GB transceivers and powerful switch-mode power supplies for all on-board voltages. Dispone de un gran número de E/S configurables en conexiones apiladas reforzadas de alta velocidad. It is used for industrial applications.
Características y ventajas:
All power supplies on-board, single 3.3V power source required
- 14 on-board DC-DC regulators and 13 LDOs
- LP, FP, PL separately controlled power domains
Conectores B2B: 4 x 160 contactos
Rango de temperaturas de funcionamiento: -40°C a 85°C
Memory of 64-bit DDR4, 8Gb maximum and Dual SPI boot Flash in parallel, 512Mb maximum
Orificios de montaje de 3mm para disipador térmico Skyline
Resistente a golpes y vibraciones fuertes
Flash serie SPI (128Mb)
Support for all boot modes (except NAND) and scenarios
Support for any combination of PS connected peripherals
User I/O required are - 65 x MIO, 48 x HD (all), 156 x HP (3 banks), Serial transceiver: 4 x GTR + 16 x GTH, Transceiver clocks inputs and outputs - PLL clock generator inputs and outputs and
Encapsulados de 900 contactos ZU9EG
- 14 on-board DC-DC regulators and 13 LDOs
- LP, FP, PL separately controlled power domains
Conectores B2B: 4 x 160 contactos
Rango de temperaturas de funcionamiento: -40°C a 85°C
Memory of 64-bit DDR4, 8Gb maximum and Dual SPI boot Flash in parallel, 512Mb maximum
Orificios de montaje de 3mm para disipador térmico Skyline
Resistente a golpes y vibraciones fuertes
Flash serie SPI (128Mb)
Support for all boot modes (except NAND) and scenarios
Support for any combination of PS connected peripherals
User I/O required are - 65 x MIO, 48 x HD (all), 156 x HP (3 banks), Serial transceiver: 4 x GTR + 16 x GTH, Transceiver clocks inputs and outputs - PLL clock generator inputs and outputs and
Encapsulados de 900 contactos ZU9EG
Certificaciones
WEEE
Especificaciones
Atributo | Valor |
---|---|
Clasificación | Módulo |
Clasificación del kit | Módulo |
Dispositivo mostrado | TE0808-04 |
Nombre del kit | 4 GB DDR4, UltraSOM+ MPSoC-Modul with Zynq UltraScale+ XCZU9EG-2FFVC900I |
- Código RS:
- 176-0795
- Nº ref. fabric.:
- TE0808-04-09EG-2IE
- Fabricante:
- Trenz Electronic GmbH