Placa de evaluación SensL ArrayC onsemi C-Array 3mm 4x4 BOB - ARRAYX-BOB3-16P-GEVK, para usar con ARRAYC-30035-16P-PCB
- Código RS:
- 185-9585
- Nº ref. fabric.:
- ARRAYX-BOB3-16P-GEVK
- Fabricante:
- onsemi
Producto Descatalogado
- Código RS:
- 185-9585
- Nº ref. fabric.:
- ARRAYX-BOB3-16P-GEVK
- Fabricante:
- onsemi
Documentación Técnica
Legislación y Conformidad
- COO (País de Origen):
- IE
Datos del Producto
The ArrayX-BOB3-16P is an evaluation board allowing easy access to the signals from a SensL ArrayC-30035-16P, 3mm 4x4 SiPM array. See Figure 7 for details on orientating the array correctly on the BOB. The Breakout Board has a centrally located Hirose 40-way connector DF17(2.0)-40DS-0.5V(57). This connector mates with the Hirose DF17(2.0)-40DP-0.5V(57) board-to-board connector on the ArrayC-30035-16P. All signals on the array are routed via the mating connector to header pins. These pins are formed by two 20-way (10x2 row) 2.54mm pitch headers, J2 and J3. Three SMA connectors and Balun transformers are provided with 4-pin headers to allow any signal to be connected directly to the SMA or via the transformer using jumper wires. Four 7mm holes are aligned on a 25mm grid to allow mounting of the board on an optical breadboard.
Especificaciones
Atributo | Valor |
---|---|
Tecnología de sensores | SensL ArrayC |
Para Usar Con | ARRAYC-30035-16P-PCB |
Clasificación del kit | Placa de evaluación |
Nombre del kit | C-Array 3mm 4x4 BOB |