Prototipo de conector hembra Amphenol FCI 55714-102LF, 81 contactos, Macho, , Montaje Superficial, BGA
- Código RS:
- 182-2278
- Nº ref. fabric.:
- 55714-102LF
- Fabricante:
- Amphenol ICC
Producto Descatalogado
- Código RS:
- 182-2278
- Nº ref. fabric.:
- 55714-102LF
- Fabricante:
- Amphenol ICC
Documentación Técnica
Legislación y Conformidad
- COO (País de Origen):
- US
Datos del Producto
High density, high speed, discrete contact, array connector
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
Flexible ground distribution optimizes high speed signal integrity
10Gb/s differential pair performance with under 1% cross-talk
28Gb/s high speed performance documented for 4 mm and 6 mm stack height
Online s-parameter files and signal integrity performance reports improve design accuracy and time-to-market
1.27 mm x 1.27 mm grid provides 71 contacts per cm2 density to save space
Dual-point, long wipe contacts Wide range of sizes and PCB stack heights increase mechanical design flexibility
6 PCB Stack heights: 4 mm to 14mm
8 sizes: 81 to 528 positions Revolutionary, trusted BGA interconnect platform
High density standard BGA attachment lower assembly costs by using standard SMT processes
BGA natural surface tension provides self-alignment and self-leveling for multiple connector usage
Patented BGA contact attachment preserves solder ball positioning
Optimized PCB routing enhances electrical performance ball positioning Quality and Reliability
Time-tested reliability record includes Telcordia GR-1217-CORE and NPS-25298-2 options
81 Position BGA Plug, 0 mm Component Height, 1.27 mm x 1.27 mm Array, Lead-free
Especificaciones
Atributo | Valor |
---|---|
Tipo de conector hembra IC | Conector hembra para prototipos |
Tipo de Paquete | BGA |
Género | Macho |
Número de Contactos | 81 |
Material del Contacto | Aleación de Cobre |
Revestimiento del Contacto | Oro |
Valor Nominal de Corriente | 450.0mA |
Tipo de Montaje del Conector Hembra | Montaje Superficial |
Tipo de Montaje del Dispositivo | Montaje Superficial |
Tensión Nominal | 200,0 V. |
Método de Terminación | Orificio Pasante |
Material de la Carcasa | Polímero Cristal Líquido |