Conector hembra para PCB Amphenol ICC

La serie BERGSTAK® de FCI ofrece un sistema de conectores panel a panel paralelo de alta densidad y versátil que ofrece 12 alturas de apilado en PCB en nueve tamaños hasta doscientas posiciones.

Disponibles en una gama de tamaños y alturas de apilado
La carcasa especial y las características de terminal Blade-on-Beam facilitan el montaje en PCB, el acoplamiento y la fiabilidad a largo plazo
Grado de inflamabilidad alto

Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly

BergStak® 0.80 mm Pitch, Receptacle, Vertical, Double Row, 80 Positions.

Montaje en PCB