Conector macho para PCB Amphenol ICC serie BergStak de 120 vías, 2 filas, paso 0.8mm, para soldar, Montaje Superficial
- Código RS:
- 182-2241
- Nº ref. fabric.:
- 61083-123402LF
- Fabricante:
- Amphenol Communications Solutions
Temporalmente fuera de stock. Disponible a partir del 15/10/2024, con entrega en 4 día(s) laborable(s).
Precio unitario (Suministrado en Carretes de 450)
4,531 €
(exc. IVA)
5,483 €
(inc.IVA)
Unidades | Por unidad | Por Carrete* |
---|---|---|
450 + | 4,531 € | 2.038,95 € |
*precio indicativo
- Código RS:
- 182-2241
- Nº ref. fabric.:
- 61083-123402LF
- Fabricante:
- Amphenol Communications Solutions
Documentación Técnica
Legislación y Conformidad
- COO (País de Origen):
- CN
Datos del Producto
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
Housing and terminal profile guarantees support of up to 12Gb/s
Vertical versus vertical mating configuration
40 to 200 position sizes in 20 position increments
5 mm to 20 mm stack heights in 1 mm increments
0.8 mm double-row contact pitch conserves printed circuit board space
Scoop-proof feature housings
Multiple plating options available
Multiple packaging options available
PCB locator pegs option
Lead-free
Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights
Suitable for parallel board stacking applications
Comprehensive range of sizes and stack heights to satisfy all needs
High density for all electrical applications needs
Prevents reverse mating
Satisfies different application requirement
Suitable for varies feeding processing
Facilitates ease and accuracy during manual assembly
BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 120 Positions.
Especificaciones
Atributo | Valor |
---|---|
Serie | BergStak |
Paso | 0.8mm |
Número de Contactos | 120 |
Número de Filas | 2 |
Orientación del Cuerpo | Recto |
Recubierto/No Recubierto | Recubierto |
Sistema de conectores | Placa a Placa |
Tipo de Montaje | Montaje Superficial |
Método de Terminación | Soldador |
Revestimiento del Contacto | Oro |
Material del Contacto | Latón |
Número de serie | 61083 |
Valor Nominal de Corriente | 800.0mA |
Tensión Nominal | 100,0 V. |
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